AOS 53300 Non-Silicone Thermal Compound
AOS Thermal Compounds
53300IE
| Pricing: | |
|---|---|
| 1 or above | $164.93 |
Features
- Long-term material stability
- Virtually no bleed or evaporation over wide temperatures
- Compound will not leach, dry, harden or melt in typical industrial applications
- Packaged in 1 pound jar
Product Description
AOS Non-Silicone Heat Sink Compound 370 was created developed over 35 years ago by AOS to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation. The primary advantage of this non-silicone product is long-term material stability. This means that the compound stays put and on the job over the full operable life of your hardware, exhibiting virtually no bleed or evaporation over a wide operating temperature range - even in a vacuum atmosphere (10-5 tor/mil, 24 hrs. @ 100°C). Compound will not leach, dry, harden, or melt in normal industrial use.
Silicone-based compounds have an undesirable tendency to physically migrate and contaminate components nearby. This interferes with circuit operation long after hardware installation to cause unexpected, untimely and often inaccessible problems. The AOS Heat Sink Compound no creep feature extends circuit life by protecting components longer and by eliminating premature failure of adjacent components caused by migrating silicone base fluid.
